INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORMED IN A CONDUCTIVE ROUTING REGION
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United States of America Patent
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Issued Date -
Aug 22, 2024
app pub date -
Jul 13, 2023
filing date -
Feb 21, 2023
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Abstract
An integrated circuit (IC) package includes a bare die mounted on a substrate, and a conductive routing region including conductive routing structure and an inductor. The conductive routing structure is conductively connected to the bare die, and includes conductive elements formed in multiple conductive routing layers in the conductive routing region. The inductive device includes a winding formed in at least one conductive routing layer of the multiple conductive routing layers.
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