STRUCTURE AND METHOD FOR BONDED WAFER BARRIER
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United States of America Patent
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Issued Date -
Aug 22, 2024
app pub date -
Apr 28, 2023
filing date -
Feb 16, 2023
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Abstract
An example apparatus includes a semiconductor device layer including a bond pad area, a bond pad on the semiconductor device layer in the bond pad area; a scribe seal on the semiconductor device layer, the scribe seal surrounding the bond pad on at least three sides; and a swarf barrier on the scribe seal, the swarf barrier including: a first portion a first distance from the semiconductor device layer; and a second portion a second distance from the semiconductor device layer, the second distance being larger than the first distance.
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