SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Aug 22, 2024
app pub date -
Apr 30, 2024
filing date -
Dec 1, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes a semiconductor element; a first lead including a die pad portion and a first terminal portion, and a sealing resin. A first lead reverse surface is exposed from a second resin surface. The first terminal portion includes a first portion extending outward from a third resin surface to a first side in an x direction, a second portion located on a first side in a z direction relative to the first portion and used for mounting, and a third portion interposed between the first portion and the second portion. The second portion overlaps with the sealing resin as viewed in the z direction.
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