CLUSTERED IC DIES TO INCREASE IC DIES PER WAFER
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United States of America Patent
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Issued Date -
Aug 22, 2024
app pub date -
Feb 21, 2023
filing date -
Feb 21, 2023
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Abstract
A reticle includes a body having a single-use illumination field. The single-use illumination field defines a layer including: a plurality of integrated circuit (IC) die clusters, each of the plurality of IC die clusters including a plurality of IC dies separated by a first scribe line having a first width. The plurality of IC die clusters are arranged in juxtaposition on the body and are separated by a second scribe line having a second width larger than the first width. The IC die clusters each have a same number of IC dies and a same area. There may be a different number of IC dies in an X direction than in a Y direction. The wider scribe lines are configured to include all optical or electrical test structures, and minimize effective die area. A wafer formed using the reticle and a method of forming the reticle are also provided.
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