Method For Manufacturing Electrical Devices
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United States of America Patent
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Issued Date -
Aug 22, 2024
app pub date -
Feb 16, 2024
filing date -
Feb 22, 2023
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Abstract
An improved method for manufacturing an electrical device is described herein. In some embodiments according to the present disclosure, the method includes: providing a base layer with a coil set, thermal flattening the base layer, and forming a circuit on the base layer opposite of the coil set in the base layer.
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