SUBMODULE FOR SEMICONDUCTOR TRANSFORMER IN SINGLE PACKAGING WITH EXCELLENT PERFORMANCE OF INSULATION AND PREVENTION AGAINST INSULATION HEATING
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United States of America Patent
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Issued Date -
Aug 22, 2024
app pub date -
Nov 22, 2022
filing date -
Apr 13, 2022
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Abstract
The present invention relates to a submodule for a semiconductor transformer in single packaging with excellent performance of insulation and prevention against induction heating that is capable of preventing induction heating caused by a magnetic field generated from coils by being equipped with a shield with at least specified conductivity in the semiconductor transformer while improving insulation performance by securing separation distance between a high voltage unit and a low voltage unit in the semiconductor transformer. The submodule for the semiconductor transformer in single packaging with excellent performance of insulation and prevention against induction heating in accordance with the present invention comprises: a high voltage unit for converting high-voltage low-frequency AC power into high-voltage AC power; a transforming unit for converting the high-voltage AC power into low-voltage AC power; and a low voltage unit for converting the low-voltage AC power into low-voltage DC power.
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