METHOD OF FABRICATING SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Aug 22, 2024
app pub date -
Oct 19, 2023
filing date -
Feb 17, 2023
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Abstract
A method of fabricating a semiconductor device may include forming a target pattern on a first wafer by performing a first exposure process, measuring a misalignment value of the target pattern, calculating a block misalignment value and a pattern misalignment value based on the misalignment value, calculating a block correction value based on the block misalignment value and calculating a pattern correction value based on the pattern misalignment value, and performing a second exposure process on a second wafer, based on the block correction value and the pattern correction value.
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