Arrangement For Monitoring the Condition of a Power Semiconductor Module of an Electric Drive Device
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United States of America Patent
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Issued Date -
Aug 22, 2024
app pub date -
Feb 15, 2024
filing date -
Feb 22, 2023
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Abstract
The present invention relates to the field of electric drive devices and arrangements comprising a plurality of power semiconductor components formed in or on a common substrate, and more particularly to an arrangement for monitoring the condition of a power semiconductor module of an electric drive device and an electric drive device. The arrangement for monitoring the condition of a power semiconductor module of an electric drive device comprises at least one pair of sensor elements, each pair comprising a first PCB copper trace sensor element and a second PCB copper trace sensor element, arranged on a printed circuit board parallel next to each other as a sensor element pair, wherein said first PCB copper trace sensor element is connected to a positive DC supply voltage source (UDC+) and said second PCB copper trace sensor element is connected to a negative DC supply voltage source (UDC−) of said electric drive device so that upon applying the DC supply voltage of said electric drive device said DC supply voltage is applied to said at least one pair of sensor elements at the same time as to the circuit components of the power semiconductor module.
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