WAFER TRANSFER APPARATUS, WAFER TRANSFER SYSTEM, AND METHOD FOR REMOVING PARTICLES IN WAFER TRANSFER APPARATUS
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United States of America Patent
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Issued Date -
Aug 22, 2024
app pub date -
Sep 22, 2023
filing date -
Feb 16, 2023
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Abstract
A wafer transfer apparatus includes a plate, a first belt unit on a first surface of the plate and including a first linear motion (LM) guide movable up and down, a second belt unit on the first surface of the plate and including a second LM guide movable up and down, a robot between the first belt unit and the second belt unit connected to the first LM guide and the second LM guide, and configured to transfer a wafer in a vertical direction, and a buffer unit between the first belt unit and the second belt unit in a first direction and disposed between the plate and the robot in a second direction perpendicular to the first direction, wherein the buffer unit includes a plurality of centrifugal fans configured to discharge fluid from an inner space of the buffer unit to an outside of the buffer unit.
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