BUBBLER FOR USE IN SEMICONDUCTOR MANUFACTURING PROCESS
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United States of America Patent
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Issued Date -
Aug 22, 2024
app pub date -
Jan 26, 2024
filing date -
Jan 27, 2023
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Abstract
There is provided a chemical supply device for use in a semiconductor manufacturing process, the chemical supply device including a bubbler, wherein the bubbler includes: a lower support surface including a lower concave portion; a side surface smoothly connected to the lower support surface through a corner curved portion; an upper surface extended from the side surface; an inlet extended from an outside of the upper surface to an inside of the bubbler, and configured to inject an output gas for causing a chemical solution contained in the bubbler to evaporate; and an outlet configured to transmit the chemical salutation evaporated in the bubbler, wherein a radius of curvature of the upper surface is greater than or equal to 45% and less than 58% of a diameter of the lower support surface.
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