METHOD OF MANUFACTURING A BONDED SUBSTRATE STACK BY SURFACE ACTIVATION
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United States of America Patent
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Aug 15, 2024
app pub date -
Apr 1, 2024
filing date -
Nov 3, 2020
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A method of manufacturing a bonded substrate stack includes: providing a first substrate having a first hybrid interface layer, the first hybrid interface layer including a first insulator and a first metal; providing a second substrate having a second hybrid interface layer, the second hybrid interface layer including a second insulator and a second metal; surface-activating the first hybrid interface layer and the second hybrid interface layer by particle bombardment; and bringing the surface-activated first hybrid interface layer and the surface-activated second hybrid interface layer into contact, such that the first and second insulators bond together and the first and second metals bond together at the same time.
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