SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR
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United States of America Patent
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Issued Date -
Aug 15, 2024
app pub date -
May 30, 2022
filing date -
May 30, 2021
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Abstract
According to an embodiment of the present disclosure, a bonding structure is provided, the bonding structure including: a first substrate including a first bonding surface including a first signal transmission metal region and a first ground metal region insulated from the first signal transmission metal region; and a second substrate bonded to the first substrate, the second substrate including a second bonding surface including a second signal transmission metal region and a second ground metal region insulated from the second signal transmission metal region, wherein the first signal transmission metal region and the second signal transmission metal region are bonded, and the first ground metal region and the second ground metal region are bonded.
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