SUBSTRATE PLANARIZATION DEVICE, DEPOSITION SYSTEM INCLUDING THE SAME, AND METHOD OF OPERATING SUBSTRATE PLANARIZATION DEVICE
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United States of America Patent
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Issued Date -
Aug 15, 2024
app pub date -
Jan 17, 2024
filing date -
Feb 9, 2023
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Abstract
A substrate planarization device according to embodiments of the present disclosure may include a peripheral coupler including a first electrostatic chuck configured to be attached to a peripheral area of a substrate, and a first elevator configured to raise and lower the first electrostatic chuck in a vertical direction within a first movable range, and a central coupler including a second electrostatic chuck configured to be attached to a central area of the substrate, and a second elevator that is configured to raise and lower the second electrostatic chuck in the vertical direction within a second movable range that is greater than the first movable range. According to the substrate planarization device, a deposition system comprising the same, and a method of operating the substrate planarization device according to embodiments of the present disclosure, the substrate can be planarized.
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