POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND METHOD FOR POLISHING A SUBSTRATE USING THE SAME

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United States of America Patent

APP PUB NO 20240274439A1
SERIAL NO

18404979

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Abstract

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A polishing composition for a semiconductor process includes polishing particles. The polishing particles have a Ds value of 700 nm2 to 1400 nm2 according to Equation 1 below;

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Patent Owner(s)

Patent OwnerAddress
SK ENPULSE CO LTD1043 GYEONGGI-DAERO GYEONGGI-DO PYEONGTAEK-SI 17784

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HAN, Deok Su Seoul, KR 18 0
HONG, Seung Chul Seoul, KR 22 63
KIM, Hwan Chul Seoul, KR 43 369
PARK, Han Teo Seoul, KR 19 3

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