METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE
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United States of America Patent
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Aug 8, 2024
app pub date -
Feb 21, 2022
filing date -
Jun 3, 2021
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Abstract
A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film (13) in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the first thermoplastic resin is equal to or lower than the softening point of the second thermoplastic resin.
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