BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE, AND RELATED METHODS

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United States of America Patent

APP PUB NO 20240266318A1
SERIAL NO

18624311

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Abstract

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A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a manifold configured to provide a reducing gas to a bonding area of the bonding system. At least a portion of the manifold is heated.

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Patent Owner(s)

Patent OwnerAddress
KULICKE AND SOFFA INDUSTRIES INC1005 VIRGINIA DRIVE CHRISTOPHER M SPLETZER SR FORT WASHINGTON PA 19034

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bajwa, Adeel Ahmad Blue Bell, US 11 12
Chylak, Robert N Warminster, US 10 17
Colosimo,, JR Thomas J West Chester, US 25 68
Wasserman, Matthew B Radnor, US 24 92

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