DIRECT COOLING TYPE SEMICONDUCTOR PACKAGE UNIT AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Aug 8, 2024
app pub date -
Feb 4, 2024
filing date -
Feb 3, 2023
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Abstract
A direct cooling type semiconductor package unit includes a substrate made of a material capable of manufacturing a semiconductor device, and having a material layer for forming the semiconductor device stacked on one side of the substrate, and a flow channel through which a cooling fluid flows formed on the other side of the substrate to enable direct cooling of the semiconductor device using the cooling fluid; a packaging block disposed at a position spaced apart from the substrate for packaging the semiconductor device, and having an electrode electrically connected to the semiconductor device through wiring and placed thereon to be insulated; a heat sink unit disposed on a lower side of the packaging block and having a fluid movement region formed at a position corresponding to a flow channel of the substrate; and a thin film type structure disposed between the substrate and the heat sink unit for coupling between the substrate and the heat sink unit and being moldable to have pattern structures of various shapes through a dry film resist (DFR) lithography process.
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