SENSOR COVER AND SENSOR MODULE
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United States of America Patent
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Issued Date -
Aug 8, 2024
app pub date -
Apr 3, 2024
filing date -
Oct 22, 2021
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Abstract
A sensor cover, provided in an opening of a housing that houses a sensor, includes a conductor; a dielectric multilayer film; and a heating film, in a desired order from an outside of the housing toward an inside of the housing. The conductor and the heating film are insulated from each other. A shortest distance between the conductor and the heating film is 2.0 μm or more.
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