IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS
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United States of America Patent
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Issued Date -
Aug 1, 2024
app pub date -
Apr 1, 2022
filing date -
Dec 24, 2021
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Abstract
Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.
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