CIRCUIT BOARD STRUCTURE, INFORMATION PROCESSING METHOD AND APPARATUS, AND COMMUNICATION DEVICE
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United States of America Patent
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Issued Date -
Aug 1, 2024
app pub date -
Apr 11, 2024
filing date -
Oct 12, 2021
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Abstract
A circuit board structure, an information processing method and apparatus, and a communication device. The circuit board structure includes a circuit board substrate, a temperature drift processing chip, and at least two heat-sensitive elements; the circuit board substrate including a first substrate and a second substrate opposite the first substrate. The first substrate is provided with a heat-generating device; and the second substrate has a cavity, the cavity being provided with at least one boss extending toward the first substrate. The heat-generating device is located between the first substrate and the boss; the at least two heat-sensitive elements are disposed at a peripheral position of the heat-generating device; and the temperature drift processing chip is electrically connected to the at least two heat-sensitive elements, and the temperature drift processing chip is disposed on the circuit board substrate.
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