Power Transistor Thermal Control via Integrated Thermoelectric Device
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United States of America Patent
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Aug 1, 2024
app pub date -
Jan 31, 2023
filing date -
Jan 31, 2023
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Abstract
The present disclosure introduces integrated circuits and related manufacturing methods, wherein each integrated circuit includes an electronic device and a thermoelectric circuit. The electronic device is formed in and/or over a semiconductor substrate. The thermoelectric circuit includes thermopiles formed in and/or over the semiconductor substrate and electrically connected in series. The thermoelectric circuit is configured to modulate operation of the electronic device in response to a potential produced by the plurality of thermopiles.
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