ON-CHIP DUAL-MODE TRANSMISSION LINE WITH SPOOF SURFACE PLASMON BASED ON BALUN
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 1, 2024
app pub date -
Feb 6, 2024
filing date -
Nov 22, 2022
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An on-chip dual-mode transmission line with an spoof surface plasmon based on a balun includes a dual-mode transmission line located in the intermediate, the balun structures symmetrically located at both terminals of the dual-mode transmission line, and pad structures and excitation portions located outside the balun structures. The dual-mode transmission line comprises two metal strip lines that are the same in structure and parallel to each other, and the branches located between the two metal strip lines. The dual-mode transmission line can simultaneously support the transmissions of the odd-mode spoof surface plasmon signal and the even-mode spoof surface plasmon signal, and is not only suitable for III-V chips such as gallium arsenide and silicon nitride, but also suitable for technologies such as other chips and printed circuit boards.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully