Power Routing for 2.5D or 3D Integrated Circuits Including a Buried Power Rail and Interposer with Power Delivery Network
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United States of America Patent
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Issued Date -
Aug 1, 2024
app pub date -
Apr 15, 2024
filing date -
Sep 9, 2021
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Abstract
Embodiments relate to an electronic circuit implemented using a first integrated circuit die, a second integrated circuit die, and an interposer connecting the first integrated circuit die to the second integrated circuit die. The first integrated circuit die implements a first electronic circuit. The first integrated circuit die includes a first set of contacts on a bottom surface, a buried power rail (BPR), and a plurality of through-silicon vias (TSV) for connecting the BPR to the first set of contacts. The interposer includes a second set of contacts and a power delivery network (PDN). Each contact of the second set of contact corresponds to a contact of the first set of contacts of the first integrated circuit die. The PDN is configured to route a power supply voltage to the second set of contacts.
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