SEMICONDUCTOR WAFER PROCESSING SYSTEM AND METHOD
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United States of America Patent
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Issued Date -
Aug 1, 2024
app pub date -
Feb 12, 2024
filing date -
Jun 18, 2021
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Abstract
A semiconductor wafer processing system includes a stocker having an interior surface, a wafer carrier disposed within the stocker, a wafer shelf disposed within the wafer carrier for storing a semiconductor wafer, and a discharge circuit including a first conductor electrically coupled to the wafer shelf and a first current controller electrically coupled to the first conductor and to the interior surface of the stocker.
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