Surface Treatment Compositions and Methods

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United States of America Patent

APP PUB NO 20240258111A1
SERIAL NO

18434199

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Abstract

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This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM ELECTRONIC MATERIALS U S A INC80 CIRCUIT DRIVE N KINGSTOWN RI 02852

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mizutani, Atsushi Shizuoka, JP 129 834
Park, Keeyoung Chandler, US 17 48
Takahashi, Kazutaka Gilbert, US 67 394
Wojtczak, William A Mesa, US 58 835

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