Method of Dispositioning and Control of a Semiconductor Manufacturing Process
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United States of America Patent
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Aug 1, 2024
app pub date -
Jan 17, 2024
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Apr 13, 2017
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Abstract
A method for predicting manufacturing variation is disclosed. The method may include measuring corresponding physical characteristics of multiple semiconductor features on multiple wafers produced using a semiconductor manufacturing process, and estimating a mean and a variance using the corresponding physical characteristics. The method may further include predicting manufacturing variation of the semiconductor manufacturing process using the mean and the variance, controlling the semiconductor manufacturing process using the predicted manufacturing variation, or determining a disposition of at least one of the multiple wafers.
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