ELECTROPLATING APPARATUS FOR SURFACE MODIFICATION OF PIPES
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United States of America Patent
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Issued Date -
Aug 1, 2024
app pub date -
Sep 18, 2023
filing date -
Jan 31, 2023
priority date (Note) -
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Abstract
The electroplating apparatus for surface modification of pipes includes: a housing comprising an inner space accommodating an electrode, a plating solution, and a pipe therein, and a plating solution inlet disposed on a lower surface of the housing and allowing the plating solution to be injected therethrough; a plating auxiliary part disposed inside the housing, vertically fixing the pipe inserted into the housing, and guiding the plating solution injected into the housing to flow toward an upper portion of the housing; and an auxiliary support part disposed inside the housing, spacing the plating auxiliary part and the plating solution inlet apart from each other by a predetermined distance, and guiding the plating solution introduced through the plating solution inlet to flow in a direction, where the plating auxiliary part is disposed.
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