Curable Compositions for Composite and Tool Release

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240254374A1
SERIAL NO

18560433

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Abstract

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The present disclosure relates generally to two part adhesive compositions comprising a resin part including a curable resin selected from multifunctional, hydroxyl di-terminated polymer having alkene segments and epoxide segments in the polymer chain; an epoxy di-terminated block copolymer having siloxane moieties and bisphenol A moieties in the backbone and combination thereof and a hardener part including a curative for the curable resin. When mixed the compositions cure to a form that provides hardness but relatively low bond strength to a substrate and which can be removed from metal and other surfaces easily and simply with little residue.

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Patent Owner(s)

Patent OwnerAddress
HENKEL IP & HOLDING GMBHDUESSELDORF

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Chih-Min Westford, US 27 168
Liu, Zhongwei Newington, US 11 13
Verosky, Christopher Coventry, US 5 13
Welch, Kevin Wallingford, US 3 5
Yi, Daniel Great Neck, US 4 12

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