POLISHING COMPOSITION, POLISHING METHOD USING THE POLISHING COMPOSITION, AND METHOD FOR PRODUCING METALLIC MOLD USING THE POLISHING COMPOSITION

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United States of America Patent

APP PUB NO 20240254364A1
SERIAL NO

18423589

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Abstract

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The present invention provides a polishing composition which is capable of rapidly removing scratches and exhibits a high polishing rate without deteriorating surface quality. One aspect of the present invention relates to the polishing composition contains abrasive grains having a Mohs hardness of 8 or more, and a dispersing medium, wherein the abrasive grains have two or more local maximum points at different particle sizes in a volume-based particle size distribution measured by a porous electrical resistance method.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATED1-1 CHIRYO 2-CHOME NISHIBIWAJIMA-CHO KIYOSU-SHI AICHI 4528502 ?4528502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HOTTA, Kazutoshi Kiyosu-shi, JP 8 31
ITO, Yuuichi Kiyosu-shi, JP 11 30
MORINAGA, Hitoshi Kiyosu-shi, JP 68 521
YAMADA, Yuta Kiyosu-shi, JP 13 26

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