SYSTEMS AND METHODS FOR WAFER DIE ASSEMBLY BONDING
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 1, 2024
app pub date -
Jan 26, 2023
filing date -
Jan 26, 2023
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A wafer die assembly includes a first wafer having at least a central cavity defined therein. The wafer die assembly includes a second wafer mounted to the first wafer. At least one of the first or second wafers includes an etched pattern. The etched pattern including at least one peripheral cavity, and a raised area raised relative to the peripheral cavity. A method of assembling a wafer die assembly includes etching a central cavity into a first wafer and etching a pattern into at least one of the first wafer or a second wafer. The first wafer and/or the second wafer includes a raised area raised relative to the peripheral cavity or the central cavity. The method includes bonding the second wafer to the first wafer.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully