LASER SOLDERING APPARATUS, CONTROL APPARATUS, AND LASER SOLDERING METHOD
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United States of America Patent
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Issued Date -
Aug 1, 2024
app pub date -
Feb 17, 2022
filing date -
Jun 2, 2021
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Abstract
To provide a laser soldering apparatus, a control apparatus, and a laser soldering method that are capable of performing high-quality soldering by laser irradiation. A laser soldering apparatus according to the present technology includes a laser light source, a spatial light modulator (SLM), and a control unit. The laser light source emits laser light. The SLM modulates the laser light incident from the laser light source and irradiates at least one of a solder or a soldering target object with the laser light. The control unit controls the laser light source and the SLM to adjust an irradiation condition of the laser light.
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