APPARATUS, SYSTEM, AND METHOD FOR IMPLEMENTING MULTIPURPOSE SCREW HOLES IN CIRCUIT PACKAGING FOR MOBILE DEVICES
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United States of America Patent
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Issued Date -
Jul 25, 2024
app pub date -
Jan 23, 2023
filing date -
Jan 23, 2023
priority date (Note) -
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Abstract
A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.
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