HEAT-CONDUCTIVE COMPOSITION, HEAT-CONDUCTIVE MEMBER, AND BATTERY MODULE
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Jul 25, 2024
app pub date -
Mar 25, 2022
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Mar 31, 2021
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Abstract
The present invention provides a thermally conductive composition comprising (A) an organopolysiloxane containing at least two alkenyl groups, (B) a hydrogenorganopolysiloxane containing at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) a reaction rate controlling agent, wherein in measurement using a viscoelasticity measuring apparatus under conditions of 35° C., a shear mode, a frequency of 1 Hz, and a strain of 10%, a storage modulus G′1 after 3,600 seconds from the start of the measurement is 2,000 Pa or less, and a storage modulus G′2 after 7,200 seconds from the start of the measurement is 4,350 Pa or more, and wherein viscosity measured at 25° C. and a shear rate of 10 rpm is 220 Pa·s or less. According to the present invention, it is possible to provide the thermally conductive composition that has good workability and maintains reliability as a product, over a relatively wide temperature range.
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