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Abstract

Apparatuses and methods are described for substrate materials and designs for controlling heat dissipation from semiconductor devices such as light-emitting diodes (LEDs). The embodiments may reduce temperature increases of semiconductor devices during operation. In some examples, a substrate structure is manufactured with a plurality of fins positioned along a first side. A plurality of heating sources, such as electronic components that generate heat, may be positioned along a second side of the substrate structure. The plurality of heat sources may be positioned to be laterally offset from the plurality of fins. In some examples, a plurality of LEDs are positioned along the first side of the substrate structure and at least partially laterally in line with the plurality of fins. In some examples, the plurality of LEDs are positioned along the first side of the substrate structure and laterally offset from the plurality of fins.

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First Claim