MECHANICAL STIFFENER FOR INTEGRATED CIRCUIT PACKAGE WITH VARYING HEAT DISSIPATION MODES
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United States of America Patent
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Issued Date -
Jul 25, 2024
app pub date -
Jan 22, 2024
filing date -
Jan 24, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit device package includes a substrate, at least two integrated circuit dies mounted to the substrate, and a thermally conductive stiffener attached to the substrate to counteract warping of the substrate. The stiffener has a first portion in a thermally conductive relationship with a surface of a first integrated circuit die to provide a first heat dissipation mode for the first integrated circuit die, and has a second portion, different from the first portion, the second portion being configured to provide a second heat dissipation mode, different from the first heat dissipation mode, for a second integrated circuit die. The stiffener may be configured to expose a surface of the second integrated circuit die through an opening in the stiffener. A heat sink may be disposed in a thermally conductive relationship with the second integrated circuit die through the opening in the stiffener.
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