METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON, APPARATUS AND DEVICE
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United States of America Patent
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Issued Date -
Jul 25, 2024
app pub date -
Jan 18, 2024
filing date -
Jan 20, 2023
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Abstract
A semiconductor die is arranged at a die mounting location of a substrate. The substrate includes an array of electrically conductive leads at the periphery of the substrate. Electrical coupling is provided between the semiconductor die and selected ones of the electrically conductive leads in the array of electrically conductive leads via electrically conductive ribbons. Each ribbon has a body portion with a first width as well as first and second end portions bonded to the semiconductor die and to the electrically conductive leads, respectively. At least one of the first and second end portions of the electrically conductive ribbon includes a tapered portion having a second width smaller than the first width of the body portion.
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