BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Jul 25, 2024
app pub date -
Jan 16, 2024
filing date -
Jan 19, 2023
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Abstract
An electronic device comprises: a printed circuit board; an integrated circuit that is coupled to the printed circuit board on a first side and a thermal solution on a second side; a thermal interface material that is disposed between the integrated circuit and the thermal solution; and a first barrier seal that is disposed around a perimeter of the integrated circuit and is electrically insulative.
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