WAFER CARRIER
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United States of America Patent
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Issued Date -
Jul 25, 2024
app pub date -
Jan 16, 2024
filing date -
Jan 19, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A wafer carrier with a bottom for connecting to a shaft includes a disc body and at least one heat insulator. The disc body has an accommodating groove for accommodating a wafer, and the disc body has a first surface and a second surface opposing each other. A groove bottom of the accommodating groove has the first surface. The at least one heat insulator is disposed on either the first surface or the second surface. When the wafer is accommodated in the accommodating groove, the at least one heat insulator is positioned between the wafer and the shaft.
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