WAFER MEASUREMENT APPARATUS AND OPERATING METHOD THEREOF
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United States of America Patent
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Jul 25, 2024
app pub date -
Aug 30, 2023
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Jan 20, 2023
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A wafer measurement apparatus includes an electronic-optical system configured to irradiate a wafer with an electron beam and acquire a raw signal by detecting electrons emitted by the wafer, and an image processing device configured to convert the raw signal acquired by the electronic-optical system into image data. The electronic-optical system includes a detector configured to acquire the raw signal. The detector calibrates a gain offset using a difference in electron emission yields of different materials.
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