SEALED FORCE SENSOR WITH ETCH STOP LAYER
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United States of America Patent
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Issued Date -
Jul 25, 2024
app pub date -
Mar 6, 2024
filing date -
Nov 2, 2017
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Abstract
An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate, where a cavity is formed in the first substrate and where at least a portion of the second substrate defines a deformable membrane. The MEMS force sensor can also include an etch stop layer arranged between the first substrate and the second substrate, and a sensing element arranged on a surface of the second substrate. The sensing element can be configured to convert a strain on the surface of the membrane substrate to an analog electrical signal that is proportional to the strain.
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