PACKAGE STRUCTURE WITH SUPPORTING FRAME
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United States of America Patent
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Issued Date -
Jul 25, 2024
app pub date -
Apr 8, 2024
filing date -
Mar 31, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A package structure includes a carrier, a frame, and at least one photonic device. The carrier includes a substrate and a plurality of first metal pads and second metal pads. The substrate includes a first surface and a second surface that are opposite to each other. The first metal pads are disposed on the first surface. The second metal pads are disposed on the second surface. A thickness of each of the second metal pads is greater than that of each of the first metal pads. The frame is disposed on the carrier, and an accommodating space is formed between the frame and the carrier. The at least one photonic device is disposed in the accommodating space.
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