METHOD FOR PRODUCING RESIN MEMBER USED IN PRODUCTION PROCESS OF ELECTRONIC DEVICES
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United States of America Patent
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Issued Date -
Jul 25, 2024
app pub date -
Apr 28, 2022
filing date -
May 17, 2021
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Abstract
There is provided a method for producing a resin member used in a production process of electronic devices capable of suppressing the adhesion of adhering substances to the surface over a long period of term. The method for producing a resin member used in a production process of electronic devices includes: a processing step of applying abrasive processing to the surface of a raw member to set a surface roughness Ra to 100 nm or less and a contact angle of pure water with respect to the surface to 70° or more and less than 110°.
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