METAL COMPONENT
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United States of America Patent
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Issued Date -
Jul 18, 2024
app pub date -
Jan 8, 2024
filing date -
Jan 18, 2023
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Abstract
Provided is a metal component that is used for manufacturing a semiconductor device, the metal component including a substrate having a conductivity; and a noble metal plating layer formed on all or part of a surface of the substrate, wherein the noble metal plating layer has a lumpy protrusion on a surface of the noble metal plating layer.
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