METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL INTERFACE MATERIAL FORMED THEREFROM, AND AN INTEGRATED CIRCUIT FORMED THEREFROM
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United States of America Patent
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Issued Date -
Jul 18, 2024
app pub date -
Dec 4, 2023
filing date -
Jan 13, 2023
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Abstract
A method of manufacture of a thermal interface material, a thermal interface material formed therefrom, and an integrated circuit formed therefrom are provided. The method includes distilling a first polymer component to form a distilled polymer component. The first polymer component includes a first concentration of volatile organic compounds and the distilled polymer component includes a second concentration of volatile organic compounds. The second concentration is at least 0.1% by weight less than the first concentration. The method comprises mixing the distilled polymer component with liquid metal to form a thermal interface material such that liquid metal droplets are dispersed throughout the distilled polymer component.
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