SEMICONDUCTOR HIGH PRESSURE ANNEALING DEVICE
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United States of America Patent
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Issued Date -
Jul 18, 2024
app pub date -
Jan 10, 2024
filing date -
Jan 18, 2023
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Abstract
A semiconductor high pressure annealing device is described. The semiconductor high pressure annealing device includes a chamber body, a cover, a lifting mechanism, and a floating sealing structure. Air tightness between the chamber body and the cover is achieved by the floating sealing structure. A first sealing ring and a second sealing ring of the floating sealing structure are arranged on the top and the bottom for reducing the damage to the first sealing ring and the second sealing ring when the cover moves up and down. A preload spring assembly of the floating sealing structure can provide tension to assist in improving the air tightness between the chamber body and the cover.
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