SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
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United States of America Patent
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Issued Date -
Jul 18, 2024
app pub date -
Apr 8, 2022
filing date -
Jun 7, 2021
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Abstract
A substrate processing method includes the steps of: a) placing a substrate having an organic film, on a placement surface of a substrate placing unit, such that the substrate is covered with a lid with a space interposed between the lid and the substrate; b) heating the lid to a second temperature higher than a first temperature while heating the placement surface of the substrate placing unit on which the substrate is placed, to the first temperature; and c) introducing a gas containing ozone into the space through the through-hole of the lid while performing the step of b).
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