WAFER PLACEMENT TABLE
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United States of America Patent
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Issued Date -
Jul 18, 2024
app pub date -
Jun 12, 2023
filing date -
Jan 12, 2023
priority date (Note) -
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Abstract
A wafer placement table includes a ceramic plate that has a wafer placement surface, a first RF electrode that is circular and that is embedded in the ceramic plate, a first RF terminal that is electrically connected to the first RF electrode, a second RF electrode that is annular and that is positioned at an outer side of the first RF electrode in plan view, and that is embedded in the ceramic plate at a different depth from the first RF electrode, a second RF terminal that is electrically connected to the second RF electrode and a connection circuit that connects the second RF terminal and the second RF electrode. The connection circuit is formed of electroconductive wires that are in a mesh-patterned form or in a radial form. A width of the electroconductive wires becomes broader from the second RF electrode toward the second RF terminal.
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