ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Jul 18, 2024
app pub date -
Dec 14, 2023
filing date -
Jan 16, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
The electronic device of the present disclosure includes a redistribution structure, chip units, and a protective layer. The redistribution structure includes alignment marks. The chip units are electrically connected to the redistribution structure, and include a first chip unit and a second chip unit. The protective layer surrounds the first chip unit and the second chip unit. The chip units and the alignment marks are arranged along a direction. The first chip unit is disposed between the first alignment mark and the third alignment mark, and the second chip unit is disposed between the second alignment mark and the fourth alignment mark. The second alignment mark and the third alignment mark are disposed between the first chip unit and the second chip unit. The number of the alignment marks is greater than the number of the chip units.
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