PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME

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United States of America Patent

APP PUB NO 20240241438A1
SERIAL NO

18403927

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Abstract

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A photoresist composition that includes a photosensitive polymer that can be cut by a chain scission mechanism due to light, a radical quencher including a phenol-based compound, and a photoactive compound (PAC) are provided.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jun, Sounghyun Suwon-si, KR 1 0
Ko, Sungmin Suwon-si, KR 2 0
Park, Juhyeon Suwon-si, KR 74 152
PARK, Sung Hwan Suwon-si, KR 66 368
Song, Hyun-Ji Suwon-si, KR 33 89

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