METHOD, USE, AND DEVICE FOR ULTRASONIC DOUBLE-WAVE MEASUREMENT OF PRE-TIGHTENING FORCE AND TEMPERATURE OF SOLID MATERIAL
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United States of America Patent
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Issued Date -
Jul 18, 2024
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Nov 12, 2021
filing date -
Jul 29, 2021
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Abstract
A method for the ultrasonic double-wave measurement includes: obtaining a first mode wave time-of-flight and a second mode wave time-of-flight of an ultrasonic double-wave of a solid material at a first temperature and stress state; measuring a first mode wave time and a second mode wave time of the ultrasonic double-wave of the solid material in an unknown state; obtaining a first mode wave temperature influence coefficient and a second mode wave temperature influence coefficient of the solid material, and a first mode wave pre-tightening force influence coefficient and a second mode wave pre-tightening force influence coefficient in the solid material to be measured having the same specification and geometric shape; and obtaining a relative change relationship of ultrasonic double-wave time-of-flight according to the first-order or second-order Taylor approximation, and jointly solving to obtain a measured pre-tightening force and a measured temperature.
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